Compare Kirin 810 vs Snapdragon 845 Chipset

HiSilocon Kirin 810 vs Snapdragon 845, Qualcomm Snapdragon 845 vs Kirn 810, Kirin 810 vs SD 845
HiSilocon Kirin 810 vs Snapdragon 845
HiSilocon Kirin 810 vs Snapdragon 845, Qualcomm Snapdragon 845 vs Kirn 810, Kirin 810 vs SD 845
HiSilocon Kirin 810 vs Snapdragon 845

On high demand of users, we brought the comparison of HiSilicon Kirin 810 vs Qualcomm Snapdragon 845. The Kirin 810 is a flagship killer chipset of 2019 whereas the Snapdragon 845 is a flagship chipset of 2018. The Kirin 810 is an upgrade over the Kirin 710 launched last while the Snapdragon 845 is a successor of the Snapdragon 835. The performance of both chipsets is quite good so we decided to compare them. By comparing them we will find the difference between the Kirin 810 and the Snapdragon 845. If you also want to know which chipset is better between the Kirin 810 and the Snapdragon 845 then read this post completely. Here you will know almost everything about these chipsets. Let’s start comparing them.

ChipsetHiSilicon Kirin 810Qualcomm Snapdragon 845

2 x Cortex-A76@2.27GH

6 x Cortex-A55@1.88GHz

4 x Cortex-A75@2.80GHz

4 x Cortex-A55@1.70GHz

GPUMali-G52@850MHzAdreno 630
Manufacturing Process7nm10nm

Dual - 40MP + 24MP

Single - 48MP

Dual - 16MP@30fps(MFNR + ZSL)

Single - 32MP@30fps(MFNR + ZSL)



RAM4 x LPDDR4X - 8GB4 x LPDDR4X - 8GB@1866MHz
StorageUFS 2.1UFS 2.1
DisplayFull HD+4K Ultra HD
ModemN/ASnapdragon X20 LTE
SpeedDownload - 1.4Gbps Upload - 200MbpsDownload - 1.2Gbps Upload - 150Mbps

Kirin 810 vs Snapdragon 845 CPU, GPU and Manufacturing Process


Starting the comparison with the CPU of HiSilicon Kirin 810, it has a 64-bit octa-core CPU having big cores and little cores. The big cores include two ARM Cortex-A76 cores clocked at 2.27GHz whereas the little cores houses six Cortex-A55 cores operating at up to 1.88GHz clock speed.

Speaking of the Snapdragon 845, it brings the company’s Kryo 385 CPU based on 64-bit memory architecture. It has only changed in its name, the CPU architecture doesn’t bring any changes. It features high-performance and high-efficiency cores, the high-performance cores include 4 ARM Cortex-A75 Gold cores clocked at 2.8GHz whereas the high-efficiency cores include 4 Cortex-A55 Silver cores running at 1.7GHz clock speed.

Here the Kirin 810 has the latest CPU cores with a tiny lower frequency while other little cores have a higher frequency in the Kirin 810. So overall the CPU performance will be better of HiSilicon Kirin 810. So in the CPU section, the Kirin 810 is a better chipset than Snapdragon 845.

Must Read: Compare Snapdragon 730 vs Snapdragon 835 Chipset


Moving to the CPU section where the Kirin 810 has the Mali-G52 GPU with a peak frequency of 850MHz. On the other side, the Snapdragon 845 features the Adreno 630 GPU. Here the Adreno 630 GPU of Snapdragon 845 is better than the GPU of the Kirin 810. So having a better GPU, the Snapdragon 845 features a smooth gaming experience and other graphic tasks.

Manufacturing Process

Talking about the Kirin 810, like this year’s flagship chipsets it is fabricated on the 7nm manufacturing process still it is a mid-range SoC. This is the world’s first mid-range chipset working on this 7nm process technology. At the same time, Snapdragon 845 is built using the 10nm fabrication process. The Snapdragon 845 is a one-year-old chipset and the company has built this chipset according to its launching time when this process technology was quite good. But today’s chipsets work on improved process technology, the same case is with the Kirin 810.

Here the Kirin 810 is ahead over the Snapdragon 845 with 2nm. Having the difference of 2nm, the Kirin 810 is a more powerful and power-efficient chipset than the Snapdragon 845 because of which it consumes less power than Snapdragon 845.

Kirin 810 vs Snapdragon 845 Artificial Intelligence

Speaking of the Snapdragon 845, it ships with the company’s Hexagon 685 DSP coupled with Hexagon Vector eXtension, All-Ways Aware technology for AI processing. Having these features, this chipset offers a decent mid-range level of AI performance. This is 2018’s flagship chipset and the company focused on that time’s AI use. Today’s mid-range chipsets can easily compete with this level of AI processing.

On the other side, Kirin 810 is the strongest mid-range chipset in terms of AI processing. It now only beats mid-range chipsets but also overtakes flagship chipsets in terms of AI. This chipset got a dedicated NPU (Neural Processing Unit) for AI processing. It has been powered with the new DaVinci architecture that works over the Rubik’s Cube Quantitative Stereo Arithmetic Unit. Having this setup for AI, it outperforms the Snapdragon 855 and the Helio P90. So in this case, the Snapdragon 845 can’t compete with the Kirin 810. Here the Kirin 810 easily wins having better AI performs over the Snapdragon 845.

Must Read: Compare MediaTek Helio G90T vs Snapdragon 855

Kirin 810 vs Snapdragon 845 Other Features


Coming to the camera department which is also stronger of Kirin 810 in this mid-range segment. The first talk about the Snapdragon 845, it arrives with the Qualcomm Spectra 280 ISP that supports up to 16MP single camera at 60fps, 32MP at 30fps with MFNR & ZSL, 48MP with MFNR only and up to 192MP without MFNR & ZSL. In the case of the dual-camera, it has support for a 16MP dual camera with MFNR & ZSL at 30fps.

At the same time, HiSilicon Kirin 810 brings support for a single camera up to 48MP and dual camera up to 40MP + 24MP.

RAM & Storage

Here the Kirin 810 supports 16-bit Quad-Channel LPDDR4X RAM up to 8GB and UFS 2.1 based storage.

While on the otherside Snapdragon 845 also supports 16-bit Quad-Channel LPDDR4X RAM up to 8GB clocked at 1866MHz and UFS2.1 Gear3 2L & SD 3.0 based storage.

Must Read: Compare Helio G90T vs Snapdragon 835 Chipsets


Here the Kirin 810 can handle Full HD+ displays with a maximum resolution of 2340×1080 pixels whereas the Snapdragon 845 is capable to support up to 4K Ultra HD displays.

Connectivity Features Comparison

Here the Snapdragon 845 ships with the Qualcomm Snapdragon X20 LTE modem with 1.2Gbps downloading speed using LTE Cat.18 and uploading speed up to 150Mbps using LTE Cat.13. It also supports other features like Tri-band WiFi, VoWiFi, Dual 4G VoLTE, Bluetooth 5.0, GPS, NFC, USB 3.1 and Qualcomm Quick Charge 4 technology for fast charging.

On the other side, HiSilicon Kirin 810 uses LTE Cat.21 to achieve a maximum downloading speed of 1.4Gbps and an uploading speed of up to 200Mbps using LTE Cat.18. It also brings support for Wi-Fi 802.11 ac, Bluetooth 5, NFC, GPS, A-GPS, etc.

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